The main electroplating is to plate the surface of materials (such as semiconductor and metal) with nickel, tin, gold and alloy. Electroless plating and physical plating are respectively adopted. The plating layer film thickness may be accurately controlled. High quality is highly recognized in the industry.
Detail
The main electroplating is to plate the surface of materials (such as semiconductor and metal) with nickel, tin, gold and alloy. Electroless plating and physical plating are respectively adopted. The plating layer film thickness may be accurately controlled. High quality is highly recognized in the industry.
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